Huawei’s latest server chip – the Kunpeng 930 is built on TSMC’s 5nm architecture. The finding was revealed in a teardown video by @Kurnalsalts who shared a video of the process. The new chip should offer nearly 2x performance jump over its predecessor, though it is still a few generations away from the latest generation of Intel and AMD offerings.
Huawei Kunpeng 930 teardown
Kunpeng 930 features a CPU fabbed on TSMC’s N5 process while the I/O die is presumably SMIC’s 14nm process. The 77.5mm x 58.0mm chip features a dual-socket motherboard including a Mount TaiShan CPU architecture with each CPU die featuring 10 CPU clusters. Each of those clusters integrates 2 CPU cores, bringing the total count to 80 cores.
In addition, each die inside the Kunpeng 930 features 91MB L3 cache and 2MB L2 cache support. The chip also brings 96 PCIe lanes with a 16-channel memory connection.
For more details, check out the video in the source link below.
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