Earlier today, the Redmi Turbo 4 became official as the first smartphone powered by the recently announced MediaTek Dimensity 8400 SoC. Not long ago, Realme revealed that it would also use this chipset in an upcoming smartphone, and speculation ensued that this would be the Realme Neo7 SE.
Today, Realme confirmed the name – it is indeed the Neo7 SE. It also revealed that it would arrive next month with the Dimensity 8400 Max inside (whereas the Redmi has the Dimensity 8400 Ultra – these are just marketing gimmicks, there usually are no real differences between MediaTek chips with such suffixes, in case you were wondering).
Supreme Weibo leaker Digital Chat Station weighed in and outed the phone’s huge battery. It seems like the Realme Neo7 SE will have a 7,000 mAh capacity, taking longevity to a whole new level. Apparently the Neo7 SE should also have better heat dissipation and, naturally, improved performance compared to its predecessor which is powered by Qualcomm’s Snapdragon 7+ Gen 3 SoC, the previous king of the mid-range.
Source 1 (in Chinese) | Source 2 (in Chinese)
